How do you make a solder mask for PCB?

What is a solder mask?

A solder mask is a protective coating that is applied to the copper traces of a PCB. Its primary functions include:

  1. Protecting the copper traces from oxidation
  2. Preventing solder bridges during the soldering process
  3. Providing electrical insulation between adjacent traces
  4. Improving the aesthetics of the PCB by adding color (usually green, red, blue, or black)

Solder masks are typically made from photoimageable polymers that can be selectively exposed and developed to create openings for component pads and vias.

Types of solder mask application methods

There are several methods for applying solder mask to PCBs, each with its own advantages and disadvantages. The most common methods include:

Screen printing

Screen printing is a popular method for applying solder mask to PCBs. It involves using a fine mesh screen with a stencil of the desired solder mask pattern. The solder mask ink is then forced through the screen onto the PCB using a squeegee. This method is suitable for low to medium volume production and can produce high-quality results.

– Cost-effective for low to medium volume production
– Suitable for a wide range of solder mask inks
– Can produce fine details and sharp edges

– Requires a separate screen for each PCB design
– Not suitable for high-volume production
– Can be time-consuming to set up and clean

Liquid photoimageable solder mask (LPISM)

Liquid photoimageable solder mask (LPISM) is a popular choice for high-volume PCB production. This method involves applying a liquid photoimageable polymer to the PCB using a curtain coating or spraying process. The coated PCB is then exposed to UV light through a photomask, which selectively hardens the solder mask. The unexposed areas are then dissolved away using a developer solution.

– Suitable for high-volume production
– Produces a thin, uniform coating
– High resolution and fine detail capabilities
– Automated process reduces labor costs

– Higher initial setup costs compared to screen printing
– Requires specialized equipment and facilities
– Limited color options compared to screen printing

Dry film solder mask (DFSM)

Dry film solder mask (DFSM) is another option for applying solder mask to PCBs. This method involves laminating a pre-formed, photoimageable film onto the PCB using heat and pressure. The film is then exposed to UV light through a photomask, selectively hardening the solder mask. The unexposed areas are then removed using a developer solution.

– Produces a consistent, uniform coating
– Suitable for high-volume production
– Excellent resolution and fine detail capabilities
– Fewer process steps compared to LPISM

– Higher material costs compared to LPISM
– Requires specialized lamination equipment
– Limited flexibility in terms of thickness and color options

Solder mask materials

Solder mask materials can be broadly categorized into two types: epoxy-based and acrylic-based. Each type has its own unique properties and advantages.

Epoxy-based solder masks

Epoxy-based solder masks are known for their excellent mechanical and chemical resistance. They offer superior adhesion to the PCB substrate and can withstand harsh environmental conditions. Epoxy-based solder masks are often used in high-reliability applications, such as automotive, aerospace, and military electronics.

– Excellent mechanical and chemical resistance
– Superior adhesion to the PCB substrate
– Suitable for high-reliability applications
– Good thermal stability

– Higher cost compared to acrylic-based solder masks
– Longer curing times
– Can be more difficult to process and handle

Acrylic-based solder masks

Acrylic-based solder masks are a popular choice for general-purpose PCB applications. They offer good electrical insulation properties, adequate chemical resistance, and are more cost-effective than epoxy-based solder masks. Acrylic-based solder masks are also easier to process and have shorter curing times.

– Cost-effective for general-purpose applications
– Good electrical insulation properties
– Adequate chemical resistance
– Easier to process and handle compared to epoxy-based solder masks
– Shorter curing times

– Lower mechanical and chemical resistance compared to epoxy-based solder masks
– May not be suitable for high-reliability applications

Solder mask application process

The solder mask application process typically involves the following steps:

  1. Surface preparation: The PCB surface is cleaned and treated to ensure good adhesion of the solder mask.
  2. Solder mask application: The solder mask material is applied to the PCB using one of the methods described earlier (screen printing, LPISM, or DFSM).
  3. Pre-bake: The coated PCB is heated to drive off solvents and improve the solder mask’s adhesion to the substrate.
  4. Exposure: The coated PCB is exposed to UV light through a photomask, selectively hardening the solder mask in the desired areas.
  5. Development: The unexposed areas of the solder mask are dissolved away using a developer solution, revealing the copper pads and traces.
  6. Curing: The PCB is subjected to a final heat treatment to fully cure the solder mask and improve its mechanical and chemical properties.
  7. Inspection: The finished PCB is inspected for defects, such as pinholes, bubbles, or misaligned openings.

Design considerations for solder mask

When designing a PCB with a solder mask, there are several important factors to consider:

  1. Solder mask clearance: Ensure that there is sufficient clearance between the copper pads and the solder mask openings to allow for proper soldering. The clearance should be at least 0.1 mm (4 mils) for standard PCBs and 0.05 mm (2 mils) for high-density designs.

  2. Solder mask thickness: The solder mask thickness should be appropriate for the application and the selected application method. Typical thicknesses range from 0.01 mm to 0.03 mm (0.4 mils to 1.2 mils).

  3. Solder mask color: Choose a solder mask color that provides good contrast with the copper traces and components for ease of inspection and assembly. Green is the most common color, but other options include red, blue, black, and white.

  4. Solder mask finish: Consider the desired surface finish for the exposed copper pads, such as HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), or OSP (Organic Solderability Preservative). The solder mask should be compatible with the selected surface finish.

  5. Solder mask registration: Ensure that the solder mask openings are accurately aligned with the copper pads and traces. Misalignment can lead to soldering difficulties and reduced reliability.

Troubleshooting common solder mask issues

Despite careful design and processing, issues can sometimes arise with solder masks. Some common problems and their potential solutions include:

  1. Pinholes or voids: These defects can be caused by contamination, air bubbles, or insufficient solder mask coverage. Ensure that the PCB surface is clean and free of contaminants, and optimize the solder mask application process to minimize air entrapment.

  2. Solder mask adhesion problems: Poor adhesion can result from inadequate surface preparation, incompatible materials, or incorrect curing. Ensure that the PCB surface is properly cleaned and treated, select compatible solder mask materials, and follow the manufacturer’s recommended curing guidelines.

  3. Misaligned solder mask openings: Misalignment can be caused by incorrect photomask design, poor registration during exposure, or distortion of the PCB substrate. Double-check the photomask design, ensure proper alignment during exposure, and consider using a more stable PCB substrate if distortion is an issue.

  4. Solder mask discoloration or fading: Discoloration can occur due to exposure to high temperatures, UV light, or certain chemicals. Select a solder mask material that is suitable for the expected environmental conditions and follow the manufacturer’s storage and handling guidelines.

Best practices for solder mask application

To achieve the best results when applying solder mask to PCBs, consider the following best practices:

  1. Use high-quality materials: Select solder mask materials from reputable suppliers and ensure that they are compatible with your PCB substrate and surface finish.

  2. Follow manufacturer’s guidelines: Adhere to the manufacturer’s recommended processing parameters, including application methods, curing times, and temperatures.

  3. Maintain a clean work environment: Keep the PCB manufacturing area clean and free of contaminants to minimize defects and improve solder mask adhesion.

  4. Implement quality control measures: Regularly inspect solder mask quality and track defects to identify and address process issues promptly.

  5. Invest in employee training: Ensure that your PCB manufacturing staff is well-trained in solder mask application techniques and best practices to maintain consistent quality.

Future trends in solder mask technology

As PCB technology continues to evolve, so too do solder mask materials and application methods. Some emerging trends in solder mask technology include:

  1. Inkjet solder mask printing: This additive process allows for the precise deposition of solder mask material, enabling finer features and reducing material waste.

  2. Environmentally friendly solder masks: There is a growing demand for solder mask materials that are free of hazardous substances and have a lower environmental impact.

  3. High-performance solder masks: New solder mask formulations are being developed to offer improved thermal stability, chemical resistance, and electrical insulation properties to meet the demands of advanced electronics applications.

  4. Direct imaging solder mask: This process uses a laser to directly expose the solder mask, eliminating the need for a photomask and enabling faster turnaround times and lower costs.


Solder mask is an essential component in the manufacturing of high-quality, reliable PCBs. By understanding the various application methods, materials, and design considerations involved, PCB manufacturers can optimize their solder mask processes to achieve the best results. As technology continues to advance, it is important to stay informed about the latest trends and best practices in solder mask application to remain competitive in the industry.


  1. What is the purpose of a solder mask on a PCB?
    A: The purpose of a solder mask is to protect the copper traces from oxidation, prevent solder bridges, provide electrical insulation, and improve the aesthetics of the PCB.

  2. What are the most common solder mask application methods?
    A: The most common solder mask application methods are screen printing, liquid photoimageable solder mask (LPISM), and dry film solder mask (DFSM).

  3. What are the differences between epoxy-based and acrylic-based solder masks?
    A: Epoxy-based solder masks offer superior mechanical and chemical resistance, while acrylic-based solder masks are more cost-effective and easier to process. Epoxy-based solder masks are often used in high-reliability applications, while acrylic-based solder masks are suitable for general-purpose PCBs.

  4. What are some common issues that can occur with solder masks?
    A: Common issues include pinholes or voids, adhesion problems, misaligned openings, and discoloration or fading. These issues can be addressed by ensuring proper surface preparation, selecting compatible materials, optimizing the application process, and implementing quality control measures.

  5. What are some future trends in solder mask technology?
    A: Future trends in solder mask technology include inkjet solder mask printing, environmentally friendly solder mask materials, high-performance solder mask formulations, and direct imaging solder mask processes. These advancements aim to improve the precision, efficiency, and sustainability of solder mask application in PCB manufacturing.