What is FPC PCB?

How are FPC PCBs Made?

FPC PCBs are manufactured using a process similar to that used for rigid PCBs. The main difference is the substrate material, which is typically a thin, flexible polymer such as polyimide or polyester. The manufacturing process typically involves the following steps:

  1. Substrate Preparation: The flexible substrate is cleaned and treated to improve adhesion of the conductive traces.

  2. Circuit Patterning: The circuit pattern is created on the substrate using a photolithographic process. This involves applying a photoresist layer, exposing it to light through a mask, and then developing the resist to reveal the circuit pattern.

  3. Metallization: A thin layer of copper is deposited onto the substrate, typically using electroplating or sputtering techniques.

  4. Etching: The unwanted copper is removed using a chemical etching process, leaving only the desired circuit pattern.

  5. Coverlay Application: A protective coverlay is applied over the circuit pattern to insulate and protect the traces.

  6. Component Assembly: Electronic components are attached to the FPC PCB using soldering or conductive adhesives.

  7. Testing and Inspection: The completed FPC PCB is tested and inspected to ensure proper functionality and quality.

Advantages of FPC PCBs

FPC PCBs offer several advantages over traditional rigid PCBs, including:

  1. Flexibility: The most obvious advantage of FPC PCBs is their flexibility. They can bend, fold, and twist without damaging the electronic connections, making them ideal for applications where space is limited or where the circuit needs to conform to a particular shape.

  2. Lightweight: FPC PCBs are typically much lighter than rigid PCBs, which can be important in applications where weight is a concern, such as in aerospace or portable electronic devices.

  3. Thin Profile: FPC PCBs can be made very thin, typically less than 0.3mm, which allows them to fit into tight spaces and reduce the overall size of the device.

  4. High Density: FPC PCBs can accommodate high-density interconnects, allowing for more complex circuits in a smaller space.

  5. Shock and Vibration Resistance: The flexibility of FPC PCBs makes them more resistant to shock and vibration than rigid PCBs, which can be important in applications where the device may be subject to rough handling or harsh environments.

Disadvantages of FPC PCBs

While FPC PCBs offer many advantages, there are also some disadvantages to consider:

  1. Cost: FPC PCBs are typically more expensive than rigid PCBs due to the specialized materials and manufacturing processes required.

  2. Limited Power Handling: The thin, flexible substrate of FPC PCBs limits their ability to handle high power applications. They are typically used for low-power applications such as sensors, displays, and interconnects.

  3. Reduced Thermal Conductivity: The thin, flexible substrate of FPC PCBs also reduces their ability to dissipate heat, which can be a concern in high-power or high-temperature applications.

  4. Limited Component Options: The thin profile and flexibility of FPC PCBs can limit the types and sizes of components that can be used, which may require specialized components or assembly techniques.

Applications of FPC PCBs

FPC PCBs are used in a wide range of applications where flexibility, lightweight, and thin profile are important. Some common applications include:

  1. Consumer Electronics: FPC PCBs are commonly used in smartphones, tablets, laptops, and other portable electronic devices where space is limited and flexibility is required.

  2. Medical Devices: FPC PCBs are used in a variety of medical devices, including wearable sensors, implantable devices, and diagnostic equipment.

  3. Automotive Electronics: FPC PCBs are used in automotive applications such as instrument clusters, entertainment systems, and sensor interconnects.

  4. Industrial Automation: FPC PCBs are used in industrial automation applications such as robotics, motion control, and machine vision systems.

  5. Aerospace and Defense: FPC PCBs are used in aerospace and defense applications where weight and space are critical, such as in satellites, aircraft, and military equipment.

Types of FPC PCBs

There are several types of FPC PCBs, each with its own unique characteristics and applications:

  1. Single-sided FPC: Single-sided FPCs have conductive traces on only one side of the substrate. They are the simplest and most cost-effective type of FPC.

  2. Double-sided FPC: Double-sided FPCs have conductive traces on both sides of the substrate, allowing for more complex circuits and higher interconnect density.

  3. Multi-layer FPC: Multi-layer FPCs have multiple layers of conductive traces separated by insulating layers, allowing for even higher interconnect density and more complex circuits.

  4. Rigid-Flex PCB: Rigid-flex PCBs combine the benefits of both rigid and flexible PCBs, with rigid sections for mounting components and flexible sections for interconnects.

  5. High-Density Interconnect (HDI) FPC: HDI FPCs use microvias and fine-pitch traces to achieve very high interconnect density, allowing for even more complex circuits in a smaller space.

FPC PCB Material Selection

The choice of substrate material is critical to the performance and reliability of FPC PCBs. The most common substrate materials used in FPC PCBs are:

Material Characteristics Typical Applications
Polyimide (PI) High heat resistance, good mechanical strength, and excellent electrical properties High-reliability applications such as aerospace, defense, and medical devices
Polyester (PET) Lower cost than polyimide, good electrical properties, and moderate mechanical strength Consumer electronics and low-cost applications
Polyethylene Naphthalate (PEN) Higher heat resistance and mechanical strength than polyester, good electrical properties Applications requiring higher performance than polyester but lower cost than polyimide

The choice of substrate material depends on the specific requirements of the application, including temperature range, mechanical stress, and electrical performance.

FPC PCB Design Considerations

Designing FPC PCBs requires careful consideration of several factors to ensure proper functionality, reliability, and manufacturability. Some key design considerations include:

  1. Bend Radius: The minimum bend radius of the FPC PCB must be considered to avoid damaging the conductive traces or components.

  2. Stiffener Placement: Stiffeners can be added to the FPC PCB to provide additional support and prevent excessive bending in certain areas.

  3. Coverlay Design: The coverlay must be designed to provide adequate insulation and protection for the conductive traces while still allowing for the desired flexibility.

  4. Trace Width and Spacing: The width and spacing of the conductive traces must be carefully designed to ensure proper electrical performance and manufacturability.

  5. Component Placement: Components must be placed in a way that allows for the desired flexibility and minimizes stress on the components and interconnects.

  6. Strain Relief: Strain relief features can be added to the FPC PCB to prevent damage from excessive bending or stretching.

FPC PCB Assembly Techniques

Assembling FPC PCBs requires specialized techniques to ensure proper alignment, bonding, and reliability of the interconnects and components. Some common assembly techniques include:

  1. Soldering: Components can be soldered to the FPC PCB using traditional soldering techniques, but care must be taken to avoid damaging the flexible substrate or components.

  2. Conductive Adhesives: Conductive adhesives can be used to attach components to the FPC PCB without the need for soldering, which can be advantageous for heat-sensitive components or substrates.

  3. Anisotropic Conductive Film (ACF): ACF is a specialized adhesive that contains conductive particles that allow for electrical connections between the FPC PCB and components without the need for soldering.

  4. Thermosonic Bonding: Thermosonic bonding uses a combination of heat and ultrasonic energy to bond the interconnects between the FPC PCB and components.

FPC PCB Testing and Inspection

Testing and inspection are critical to ensuring the quality and reliability of FPC PCBs. Some common testing and inspection techniques include:

  1. Visual Inspection: Visual inspection is used to check for obvious defects such as misaligned components, damaged traces, or contamination.

  2. Continuity Testing: Continuity testing is used to ensure that all the conductive traces are properly connected and there are no open or short circuits.

  3. Resistance Testing: Resistance testing is used to measure the resistance of the conductive traces and ensure that they meet the specified requirements.

  4. Insulation Testing: Insulation testing is used to ensure that there are no leakage paths between the conductive traces or between the traces and the substrate.

  5. Functional Testing: Functional testing is used to verify that the FPC PCB performs as intended in the final application.


  1. What is the difference between FPC and FPCB?
    FPC stands for Flexible Printed Circuit, while FPCB stands for Flexible Printed Circuit Board. Both terms refer to the same thing, which is a flexible circuit board made of a thin, flexible substrate with conductive traces and components.

  2. Can FPC PCBs be repaired?
    FPC PCBs can be repaired, but it requires specialized techniques and equipment. The most common repair methods include replacing damaged components, adding jumper wires to bypass damaged traces, and applying conductive adhesives or tapes to restore electrical connections.

  3. How long do FPC PCBs last?
    The lifespan of FPC PCBs depends on several factors, including the materials used, the operating environment, and the level of stress and strain on the board. In general, FPC PCBs are designed to withstand millions of flex cycles and can last for several years in typical applications.

  4. Can FPC PCBs be recycled?
    FPC PCBs can be recycled, but the process is more complex than recycling rigid PCBs due to the different materials used. The recycling process typically involves separating the different materials, such as the substrate, conductive traces, and components, and then recycling each material separately.

  5. What is the typical lead time for FPC PCBs?
    The lead time for FPC PCBs depends on several factors, including the complexity of the design, the materials used, and the manufacturing process. In general, lead times can range from a few days to several weeks, depending on the specific requirements of the project.


FPC PCBs are a versatile and reliable solution for applications that require flexibility, lightweight, and thin profile. They offer many advantages over traditional rigid PCBs, including the ability to bend, fold, and twist without damaging the electronic connections, as well as high interconnect density and shock and vibration resistance.

However, FPC PCBs also have some disadvantages, such as higher cost, limited power handling, and reduced thermal conductivity. The choice of substrate material, design considerations, assembly techniques, and testing and inspection methods must be carefully considered to ensure proper functionality and reliability.

Overall, FPC PCBs are a valuable tool in the designer’s toolkit and are widely used in a range of applications, from consumer electronics to medical devices to aerospace and defense. As technology continues to advance, it is likely that FPC PCBs will continue to play an important role in enabling new and innovative electronic devices and systems.