What is the PCB manufacture process

Overview of the PCB Manufacture Process

The PCB manufacture process can be broadly divided into the following stages:

  1. PCB Design and Layout
  2. PCB Fabrication
  3. Substrate Preparation
  4. Copper Clad Lamination
  5. Drilling
  6. Plating
  7. Etching
  8. Solder Mask Application
  9. Silkscreen Printing
  10. PCB Assembly
  11. Component Placement
  12. Soldering
  13. Inspection and Testing
  14. Quality Control and Testing

Let’s explore each stage in detail.

PCB Design and Layout

Before the physical manufacturing process begins, the PCB design and layout must be created using specialized software such as Altium, Eagle, or KiCad. The design process involves the following steps:

  1. Schematic Design: The electronic circuit is designed using schematic capture software, which represents the components and their interconnections using standardized symbols.

  2. Component Selection: The appropriate components are selected based on the circuit requirements, such as voltage, current, and power ratings.

  3. PCB Layout: The schematic is translated into a physical layout, where the components are arranged on the board, and the traces (copper paths) are routed to connect them according to the schematic.

  4. Design Rule Check (DRC): The layout is checked against a set of design rules to ensure that it meets the manufacturing constraints and can be successfully fabricated.

  5. Gerber File Generation: Once the layout is finalized, Gerber files are generated, which contain the information needed for the PCB fabrication process, such as the copper layers, drill holes, and solder mask.

PCB Fabrication

The PCB fabrication process involves several steps to transform the raw materials into a functional circuit board.

Substrate Preparation

The substrate, typically made of glass-reinforced epoxy (FR-4), is cut to the desired size and shape. The substrate serves as the base material for the PCB and provides mechanical support and electrical insulation.

Copper Clad Lamination

A thin layer of copper foil is laminated onto the substrate using heat and pressure. The copper foil is typically available in thicknesses ranging from 0.5 oz to 2 oz per square foot. The lamination process ensures a strong bond between the copper and the substrate.


Holes are drilled through the copper-clad substrate to accommodate through-hole components and provide interconnections between layers. The drilling process is performed using high-speed, computer-controlled drill machines that can create holes as small as 0.1 mm in diameter.


The drilled holes are plated with a thin layer of copper to provide electrical conductivity and connect the layers of the PCB. This process is called electroplating and involves the following steps:

  1. Deburring: The drilled holes are cleaned and deburred to remove any rough edges or debris.

  2. Desmear: A chemical process is used to remove the resin smear from the hole walls, which is created during the drilling process.

  3. Electroless Copper Deposition: A thin layer of copper is deposited onto the hole walls using an electroless plating process, which does not require an external electric current.

  4. Electrolytic Copper Plating: The electroless copper layer is reinforced with an additional layer of copper using an electrolytic plating process, which involves passing an electric current through the plating solution.


The unwanted copper is removed from the substrate, leaving only the desired copper traces and pads. This process is called etching and is typically performed using one of two methods:

  1. Subtractive Etching: A photoresist layer is applied to the copper surface and exposed to UV light through a photomask, which contains the desired circuit pattern. The unexposed photoresist is removed, and the exposed copper is etched away using a chemical solution, typically ferric chloride or ammonium persulfate.

  2. Additive Etching: A reverse process where the desired circuit pattern is printed onto the substrate using a conductive ink or a plating resist. The copper is then electroplated onto the exposed areas, and the ink or resist is removed, leaving only the desired copper traces and pads.

Solder Mask Application

A layer of solder mask is applied to the PCB surface to protect the copper traces and prevent short circuits during the soldering process. The solder mask is typically green in color but can also be available in other colors such as red, blue, or black. The solder mask is applied using a screen printing process and then cured using UV light.

Silkscreen Printing

The final step in the PCB fabrication process is the silkscreen printing of the component labels, logos, and other markings onto the PCB surface. The silkscreen is typically white but can also be available in other colors. The silkscreen is applied using a screen printing process similar to the solder mask application.

PCB Assembly

Once the PCB fabrication process is complete, the board is ready for assembly. The PCB assembly process involves several steps to populate the board with components and create a functional electronic device.

Component Placement

The components are placed onto the PCB surface using automated pick-and-place machines. The machines use computer vision and precision robotics to accurately place the components onto the designated pads on the PCB surface. The components are typically supplied in tape-and-reel or tray packaging and are loaded into the machine prior to the placement process.


After the components are placed, the PCB is sent through a reflow oven to solder the components onto the board. The reflow oven uses a controlled heating profile to melt the solder paste and create a strong bond between the components and the PCB pads. The soldering process can be performed using either through-hole or surface-mount technology (SMT).

  1. Through-hole Soldering: The component leads are inserted through the drilled holes in the PCB and soldered onto the opposite side using a wave soldering machine or manual soldering iron.

  2. Surface-mount Soldering: The components are placed onto the designated pads on the PCB surface and soldered using a reflow oven or a specialized SMT soldering machine.

Inspection and Testing

After the soldering process, the PCB undergoes a series of inspection and testing procedures to ensure that it meets the required quality standards and functions as intended. The inspection and testing process can include:

  1. Visual Inspection: The PCB is visually inspected for any defects or abnormalities such as solder bridges, cold solder joints, or misaligned components.

  2. Automated Optical Inspection (AOI): An automated camera system is used to scan the PCB surface and detect any defects or anomalies that may have been missed during the visual inspection.

  3. X-ray Inspection: For complex or multi-layer PCBs, an X-ray inspection system may be used to detect any internal defects or voids in the solder joints.

  4. Functional Testing: The PCB is powered on and tested for its intended functionality using specialized test equipment or software.

Quality Control and Testing

Throughout the PCB manufacture process, various quality control measures are implemented to ensure that the final product meets the required standards and specifications. Some of the quality control measures include:

  1. Incoming Material Inspection: The raw materials used in the PCB manufacture process, such as the substrate, copper foil, and solder mask, are inspected for quality and conformance to specifications before being used in production.

  2. In-process Inspection: During the various stages of the PCB manufacture process, such as drilling, plating, and etching, in-process inspections are performed to detect any defects or anomalies and take corrective action if necessary.

  3. Final Inspection: After the PCB assembly process is complete, a final inspection is performed to ensure that the board meets all the required quality standards and specifications.

  4. Electrical Testing: The PCB is subjected to various electrical tests, such as continuity, insulation resistance, and high-potential testing, to ensure that it meets the required electrical performance specifications.

  5. Environmental Testing: Depending on the intended application, the PCB may be subjected to various environmental tests, such as temperature cycling, humidity, and vibration testing, to ensure that it can withstand the expected operating conditions.

Frequently Asked Questions

1. What is the typical turnaround time for PCB fabrication?

The turnaround time for PCB fabrication can vary depending on the complexity of the board, the quantity ordered, and the manufacturing capabilities of the PCB fabricator. For standard PCBs, the typical turnaround time can range from 1-2 weeks, while for more complex or high-volume orders, it can take several weeks or even months.

2. What is the difference between through-hole and surface-mount technology?

Through-hole technology involves installing components by inserting their leads through drilled holes in the PCB and soldering them onto the opposite side. Surface-mount technology, on the other hand, involves placing components directly onto the designated pads on the PCB surface and soldering them using a reflow oven. SMT allows for smaller components and higher component density compared to through-hole technology.

3. What is the purpose of the solder mask on a PCB?

The solder mask is a layer of polymer material applied to the PCB surface to protect the copper traces and prevent short circuits during the soldering process. It also provides electrical insulation and helps to prevent oxidation of the copper traces. The solder mask is typically green in color but can also be available in other colors for aesthetic or functional purposes.

4. Can PCBs be manufactured with multiple layers?

Yes, PCBs can be manufactured with multiple layers to increase the component density and routing complexity. Multi-layer PCBs are fabricated by laminating multiple layers of copper-clad substrates together, with each layer separated by an insulating material. The layers are interconnected using plated through-holes or vias. Multi-layer PCBs can have anywhere from 4 to 50 or more layers, depending on the application requirements.

5. What are the environmental considerations in PCB manufacturing?

PCB manufacturing involves the use of various chemicals and materials that can have an impact on the environment if not properly managed. Some of the key environmental considerations in PCB manufacturing include:

  • Proper handling and disposal of hazardous waste, such as etchants, plating solutions, and solder waste.
  • Use of lead-free solder and other eco-friendly materials to reduce the environmental impact.
  • Implementation of air and water pollution control measures to minimize the release of pollutants into the environment.
  • Compliance with environmental regulations and standards, such as RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals).


The PCB manufacture process is a complex and multi-faceted process that involves various technologies and materials to create reliable, high-quality circuit boards. From the initial design and layout to the final inspection and testing, each step in the process plays a critical role in ensuring the functionality and reliability of the final product.

As the demand for electronics continues to grow, the PCB manufacturing industry is constantly evolving to meet the changing needs of the market. New technologies and materials are being developed to enable smaller, faster, and more complex PCBs, while also addressing the environmental and sustainability challenges facing the industry.

By understanding the intricacies of the PCB manufacture process, designers, engineers, and manufacturers can work together to create innovative and reliable electronic products that meet the needs of today’s rapidly evolving technological landscape.