What is the thinnest PCB possible?

What is an Ultra-Thin PCB?

An ultra-thin PCB is a printed circuit board that has been designed to be as thin as possible while still maintaining its functionality and durability. These PCBs are typically used in applications where space is at a premium, such as smartphones, wearable devices, and medical implants.

The thickness of a PCB is measured in millimeters (mm) and is determined by the combined thickness of the board’s layers, which include:

  1. Copper layers
  2. Substrate (base material)
  3. Solder mask
  4. Silkscreen

Factors Affecting PCB Thickness

Several factors influence the minimum thickness achievable for a PCB:

1. Number of Layers

The number of layers in a PCB directly impacts its thickness. Each additional layer adds to the overall thickness of the board. Ultra-thin PCBs typically have fewer layers compared to standard PCBs.

PCB Type Typical Number of Layers
Ultra-thin 1-4
Standard 4-12
High-density 12+

2. Substrate Material

The substrate, or base material, of a PCB plays a crucial role in determining its thickness. Common substrate materials include:

  • FR-4: A popular choice for standard PCBs, but not suitable for ultra-thin designs due to its thickness and rigidity.
  • Polyimide: A thin, flexible material that is often used in ultra-thin PCBs. It offers excellent thermal and chemical resistance.
  • Liquid Crystal Polymer (LCP): Another thin, flexible option that provides superior high-frequency performance and low moisture absorption.

3. Copper Thickness

The thickness of the copper layers in a PCB also contributes to its overall thickness. Ultra-thin PCBs typically use thinner copper layers compared to standard PCBs.

Copper Weight Thickness (mm)
0.5 oz 0.0175
1 oz 0.035
2 oz 0.07

4. Manufacturing Process

Advances in PCB manufacturing technologies have made it possible to produce ultra-thin PCBs with high precision and reliability. Some of these processes include:

  • Modified Semi-Additive Process (mSAP): A method that allows for the creation of fine-pitch traces and vias, enabling thinner PCB designs.
  • Anylayer Technology: A process that eliminates the need for glass fiber reinforcement, resulting in thinner, more flexible PCBs.

The Thinnest PCBs Available

With the factors mentioned above in mind, let’s look at some of the thinnest PCBs currently available on the market:

  1. Fujitsu Ultra-Thin PCB: Fujitsu has developed a single-layer, polyimide-based PCB with a thickness of just 0.05 mm. This ultra-thin PCB is designed for use in smartcards and RFID tags.

  2. Mektec Ultra-Thin PCB: Mektec, a subsidiary of Nippon Mektron, offers ultra-thin PCBs with thicknesses ranging from 0.1 mm to 0.3 mm. These PCBs are ideal for applications such as smartphones, smartwatches, and medical devices.

  3. Interflex Ultra-Thin PCB: Interflex, a South Korean manufacturer, produces ultra-thin PCBs with thicknesses as low as 0.1 mm. Their PCBs are used in a variety of consumer electronics and automotive applications.

Applications of Ultra-Thin PCBs

Ultra-thin PCBs have found their way into numerous applications across various industries:

  1. Smartphones and Tablets: As these devices continue to get slimmer, ultra-thin PCBs are essential for maximizing space and reducing overall device thickness.

  2. Wearable Devices: Smartwatches, fitness trackers, and other wearable devices require ultra-thin PCBs to ensure comfort and flexibility for the user.

  3. Medical Implants: Ultra-thin PCBs are used in medical implants such as pacemakers and hearing aids, where space is extremely limited, and reliability is critical.

  4. Automotive Electronics: As vehicles become more technologically advanced, ultra-thin PCBs are being used in applications such as dashboard displays, infotainment systems, and driver assistance features.

Challenges in Ultra-Thin PCB Design and Manufacturing

Despite the many benefits of ultra-thin PCBs, there are several challenges associated with their design and manufacturing:

  1. Fragility: Ultra-thin PCBs are more fragile than standard PCBs, making them more susceptible to damage during handling and assembly.

  2. Thermal Management: With less space for heat dissipation, ultra-thin PCBs can be more prone to thermal issues, which can impact performance and reliability.

  3. Signal Integrity: As traces become thinner and closer together in ultra-thin PCB designs, maintaining signal integrity becomes more challenging.

  4. Manufacturing Complexity: Producing ultra-thin PCBs requires specialized equipment and processes, which can increase manufacturing costs and lead times.

Future of Ultra-Thin PCBs

As the demand for smaller, more powerful electronic devices continues to grow, the development of ultra-thin PCBs will remain a priority for manufacturers. Some of the trends and advancements we can expect to see in the future include:

  1. Increased Use of Advanced Materials: New substrate materials, such as graphene and carbon nanotubes, may enable even thinner PCB designs with improved thermal and electrical properties.

  2. 3D PCB Integration: Combining ultra-thin PCBs with 3D packaging techniques could allow for greater functionality in smaller spaces.

  3. Improved Manufacturing Processes: Advancements in PCB manufacturing technologies, such as inkjet printing and laser drilling, could make the production of ultra-thin PCBs more efficient and cost-effective.


  1. Q: What is the minimum thickness achievable for an ultra-thin PCB?
    A: Currently, the thinnest PCBs available on the market have a thickness of around 0.05 mm to 0.1 mm.

  2. Q: Can ultra-thin PCBs be used in high-power applications?
    A: Ultra-thin PCBs are generally not suitable for high-power applications due to their limited ability to dissipate heat and handle high currents.

  3. Q: Are ultra-thin PCBs more expensive than standard PCBs?
    A: Yes, ultra-thin PCBs are typically more expensive than standard PCBs due to the specialized materials and manufacturing processes required to produce them.

  4. Q: Can ultra-thin PCBs be repaired if damaged?
    A: Repairing ultra-thin PCBs can be challenging due to their fragility and the fine-pitch components often used in their assembly. In many cases, it may be more cost-effective to replace the entire PCB.

  5. Q: What is the most common substrate material used in ultra-thin PCBs?
    A: Polyimide is one of the most common substrate materials used in ultra-thin PCBs due to its thinness, flexibility, and excellent thermal and chemical resistance properties.

In conclusion, ultra-thin PCBs represent a significant advancement in PCB technology, enabling the creation of increasingly compact and sophisticated electronic devices. As manufacturers continue to push the boundaries of PCB design and manufacturing, we can expect to see even thinner and more innovative PCBs in the future. However, designers and engineers must also be aware of the challenges associated with ultra-thin PCBs and work to overcome them through careful design and collaboration with experienced PCB manufacturers.